Quality and Reliability Engineering International
Acceleration and time to fail
Journal Article
- Author(s): P. W. Hale
- Article first published online: 03 Jan 2007
- DOI: 10.1002/qre.4680020409
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Abstract
A physical model of the growth of chemically related failures in electronic components is developed. This model is used to demonstrate that time to failure is as much a function of the component geometry as it is of the activation energy of the reaction. Further interpretation suggests that for any specified failure mechanism the acceleration achieved in a high temperature stress environment will appear to be a variable. Finally, using a simulation technique, a statistical distribution of the times to fail can be generated which resembles very closely the classical exponential failure curve.
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