Quality and Reliability Engineering International
Surface mount digital package reliability
Journal Article
- Author(s): William J. Roesch
- Article first published online: 03 Jan 2007
- DOI: 10.1002/qre.4680020404
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Abstract
This paper compares the reliability of four surface mount package styles with the standard through‐hole package. Three test boards were fabricated and subjected to environmental and electrical stresses. The relative package performances of SOICs, butt‐soldered DIPs, surface mounted DIPS, and through‐hole DIPs were found to be equal when subjected to stresses exceeding those expected in normal use. PLCC packages were found to be slightly less reliable in humidity environments than the other packages.
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