Quality and Reliability Engineering International

Surface mount digital package reliability

Journal Article

Abstract

This paper compares the reliability of four surface mount package styles with the standard through‐hole package. Three test boards were fabricated and subjected to environmental and electrical stresses. The relative package performances of SOICs, butt‐soldered DIPs, surface mounted DIPS, and through‐hole DIPs were found to be equal when subjected to stresses exceeding those expected in normal use. PLCC packages were found to be slightly less reliable in humidity environments than the other packages.

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