Quality and Reliability Engineering International

Stress test development on a processor system

Journal Article

Abstract

Thermal cycling and vibration tests were carried out on an intermediate processor family of machines to investigate the benefits of controlled stressing as a means of screening manufacturing defects, and to provide data for return on investment calculations. Major items to be considered were

(a) low cost of test programme

(b) complete unit to be stressed (complex interactions between subassemblies)

(c) relatively low expected failure rate

(d) limited field reporting.

Stress techniques used were mild thermal cycling and pseudo‐random vibration.

Analysis of field data from the stressed population showed an overall reliability improvement of 24 per cent during the first 30 days of customer operation.

Related Topics

Related Publications

Related Content

Site Footer

Address:

This website is provided by John Wiley & Sons Limited, The Atrium, Southern Gate, Chichester, West Sussex PO19 8SQ (Company No: 00641132, VAT No: 376766987)

Published features on StatisticsViews.com are checked for statistical accuracy by a panel from the European Network for Business and Industrial Statistics (ENBIS)   to whom Wiley and StatisticsViews.com express their gratitude. This panel are: Ron Kenett, David Steinberg, Shirley Coleman, Irena Ograjenšek, Fabrizio Ruggeri, Rainer Göb, Philippe Castagliola, Xavier Tort-Martorell, Bart De Ketelaere, Antonio Pievatolo, Martina Vandebroek, Lance Mitchell, Gilbert Saporta, Helmut Waldl and Stelios Psarakis.