Quality and Reliability Engineering International

Electromigration in ALCu interconnections with W‐plug contacts

Journal Article

  • Author(s): L. Ferlazzo, G. Reimbold, J. P. Gonchond, M. Heitzmann, O. Demolliens, G. Lormand
  • Article first published online: 20 Mar 2007
  • DOI: 10.1002/qre.4680090410
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Abstract

Tungsten is widely investigated for contact and via filling to improve planarization and step coverage. Although many electromigration data are available on multilayered structures, very few studies have been carried out on W‐plug structures and mainly concern the vias. This paper investigates the electromigration performance of W‐plug contacts and underlines the main failure modes. A comparison is made with classical contacts and W‐plug vias, pointing out a new failure mode.

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