Quality and Reliability Engineering International

Plastic encapsulated ic reliability prediction modelling: Principal results

Journal Article

Abstract

The content of this paper is based on the study published at ESREF 91 in Bordeaux under the title ‘Plastic Encapsulated IC's in military equipments: reliability prediction modelling’. The first paper introduced the theoretical aspects of plastic encapsulated IC reliability prediction modelling. This paper presents the results of statistical studies done to complete the model with numerical data. Dependence of failure rates on year of manufacturing, dependence of thermo‐mechanical failure rate on die diagonal, distribution of the quality of ICs in the market, and environment factor defect values are the principal topics addressed in this paper.

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